http://rdf.ncbi.nlm.nih.gov/pubchem/patent/MY-145110-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f71ddd387b22b19ebcea454e62d66128 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| filingDate | 2006-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91da08f524c3890501871e3ad999e68d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a9791d3cd1098ab016f696c03b95f12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce796e679d8d0add892bc66836fb4b51 |
| publicationDate | 2011-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | MY-145110-A |
| titleOfInvention | Lead-free solder alloy |
| abstract | 1 6 LEAD-FREE SOLDER ALLOY ABSTRACT A LEAD-FI-EE SOLDER ALLOY IS PROVIDED WHICH HAS IMPROVED IMPACT RESISTANCE TO DROPPING EVEN AFTER THERMAL APING AND WBICH IS EXCELLENT WITH RESPECT TO 5 SOLDERABILITY, OCCURRENCE OF VOIDS, AND W1LOXVING. A SOLDER ALLOY ACCORDING TO THE PRESENT INVENTION CONSISTS ESSENTIALLY OF, IN MASS PERCENT, (1) AP@ 0.8 - 2.0@ (2) CUI 0.05 - 03, (3) AT LEAST ONE ELEMENT SELECTED FROM IN: AT LEAST 0.0 IAND LESS THAN O.M NI: 0.01 - 0.04, CO: 0.01 - 0.05, AND PI: 0.01 - 0. I , OPTIONALLY (4) AT LEAST ONE ELEMENT SELECTED FROM SB, BI, FE, AL, ZN, AND P IN A TOTAL AMOUNT OFUL) TO 0. I, TO AND A REMAINDER OF SIT AND IMPURITIES. X(4 2, |
| priorityDate | 2005-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.