| abstract |
ELECTRODEPOSITED COPPER FOIL WITH CARRIER FOIL AND MANUFACTURING METHOD THEREOF PROVIDED IS ELECTRODEPOSITED COPPER FOIL WITH CARRIER FOIL THAT PROVIDES HIGH BENDING STRENGTH BETWEEN A SURFACE ANDA RESIN SUBSTRATE LEVER EVER IF SURFACE ROUGHNESS IS LOW, AND HARDLY OCCURS DELAMINATION EVEN IF PIN HOLES ETC. REMAIN IN A @DULK- COPPER LAYER OR INSIDE OF THE THROUGH HOLES OR VIA HOLES ETC. AFTER CONTACTS A DESINEAR SOLUTI-ON AND THE LIKE. 10 FLECTRODEPOSITED COPPER FOIL WITH CARCI-ER FOIL, COMPRISINO I A RELEASE LAYER, A BULK COPPER LAYER , A PLAITED NI-ZN AL I OV LAYER AND A PRIMER RESIN LAYER @-,,HICH ARE FORINED IN THIS ORDER ON AT LEAST ONE SIDE OF A CARRIER FOIL, WHEREIN A ROUGHNESS IN P.@'., MEASURED ON THE SURFACE IS NOT MORE THAN 3 @TM, THE ABOVE DESCRIBED 15 PLATED HI-ZN ALLOY LA, LET: CONTAINS HI AND ZN AND HAS A DEPOSIT RATIO OF (HI WEIGHT/ZN WEIGHT] CONTAINED IN THE LAYER OF 1.5 TO 10. |