http://rdf.ncbi.nlm.nih.gov/pubchem/patent/MY-127719-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7b1787fdafc9a84f27a9e2e702132f8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| filingDate | 2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0b9ae26e9b57754d600de387777c62e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1efc79fc7c25d8ab7a922fae7ea3396 |
| publicationDate | 2006-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | MY-127719-A |
| titleOfInvention | Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
| abstract | A FAMILY OF SLURRIES USEFUL IN MODIFYING EXPOSED SURFACES OF WAFERS FOR SEMICONDUCTOR FABRICATION ARE PROVIDED ALONG WITH METHODS OF MODIFYING EXPOSED SURFACES OF WAFERS FOR SEMICONDUCTOR FABRICATION UTILIZING SUCH A FAMILY OF WORKING SLURRIES, AND SEMICONDUCTOR WAFERS. THE SLURRIES OF THE INVENTION ARE A SOLUTION OF INITIAL COMPONENTS, THE COMPONENTS COMPRISING: A SULFONATED ZWITTERION SELECTED FROM 2-(N-MORPHOLINO)ETHANESULFONIC ACID, (3-[N- MORPHOLINO] )PROPANESUL FONIC ACID, 2- [(2-AMINO-2 -OXOETHYL) AMINO] ETHANESULFONIC ACID, PIP ERAZINE-N,N’ -BI S(2 -ETHANE SULFONIC ACID), 3- (N-MORPHOLINO) -2 -HYDROXYPROPANE SULFONIC ACID, N,N-BI S(2 -HYDROXYETHYL)-2-AMINOETHANE SULFONIC ACID, 3- (N-MORPHOLINO)PROPANESUL FONIC ACID, N- (2 -HYDROXYETHYL)PIPERAZINE-N’ -(2 -ETHANESULFONIC ACID), N-TRIS(HYDROXYMETHYL)METHYL -2 AMINOETHANE SULFONIC ACID, 3- [N,N-BI S(2 -HYDROXYETHYL)AMINO] -2-HYDROXYPROPANESULFONIC ACID, 3- [N-TN S(HYDROXYMETHYL)METHYL AMINO) -2 -HYDROXYPROPANESULFONIC ACID, N-(2- HYDROXYETHYL)PIPERAZINE-N’ -(2 -HYDROXYPROPANESUL FONIC ACID), PIPERAZINE-N,N’ -BI S(2 - HYDROXYPROPANESUL FONIC ACID), N- (2 -HYDROXYETHYL)PIPERAZINE-N’-(3 -PROPANESULFONIC ACID), N- TN S (HYDROXYMETHYL)METHYL -3- AMINOPROPANE SULFONIC ACID, 3- [(1,1 -DIMETHY 1-2- HYDROXYETHYL) AMINO] - 2-HYDROXYPROPANE SULFONIC, ACID, 2- (N-CYCIOHEXYL AMINO) ETHANESUL FONIC ACID, 3- (CYCLOHEXYL AMINO) -2 -HYDROXY-I-PROPANESUL FONIC ACID, 2-AMINO -2-METHYL- 1 -PROPANOL, 3- (CYCLOHEXYLAMINO)- 1 -PROPANESULFONIC ACID, AN OXIDIZING AGENT; OPTIONALLY, A PASSIVATING AGENT; OPTIONALLY A CHELATING AGENT, OPTIONALLY ABRASIVE PARTICLES, OPTIONALLY A SURFACTANT, OPTIONALLY A SECONDARY BUFFERING AGENT AND WATER. THE METHOD OF THE INVENTION COMPRISES THE STEPS OF: A) PROVIDING A WAFER COMPRISING A FIRST MATERIAL HAVING A SURFACE ETCHED TO FORM A PATTERN AND A SECOND MATERIAL DEPOSITED OVER THE SURFACE OF THE FIRST MATERIAL; B) CONTACTING THE SECOND MATERIAL OF THE WAFER WITH ABRASIVE IN THE PRESENCE OF THE |
| priorityDate | 2002-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.