| abstract |
The invention provides aqueous alkaline compositions useful in the microelectronics industry for removal or cleaning of semiconductor wafer substrates by removing residues of photoresist material and other unwanted contaminants; The compositions typically contain (a) one or more metal ion free bases in amounts sufficient to produce a pH of about 11 or greater; (b) about 0.01% to about 5% by weight (expressed as% Si2) of water-soluble metal ion free silicate; (c) optionally, from about 0.01% to about 10% by weight of one or more chelating agents; (d) optionally, from about 0.01% to about 80% by weight of one or more water-soluble organic solvents; (e) optionally, from about 1% to about 50% by weight of titanium waste disposal improver; and (f) optionally, from about 0.01% to about 1% by weight of a water-soluble surfactant. |