patent/MX-9305446-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/MX-9305446-A

Outgoing Links

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assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5202091df9de019fc995f2d266f9ecc2
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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
filingDate	1993-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1b429a7be473b91ddf36b4eafd8403e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_416ea5984be405b9fec145373db040f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bda58665d759ae2066f66497a3e14bf
publicationDate	1994-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	MX-9305446-A
titleOfInvention	SEMICONDUCTOR PACK OF MOLDED PLASTIC WITH ALUMINUM-BASED HEAT DIFFUSER, TO ENCAPSULATE A SEMICONDUCTOR DEVICE.
abstract	This invention provides a molded plastic electronic package (40, 50), which has improved thermal dissipation. A heat diffuser (26), formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin (30). The formation of a black anodizing layer (42) on the surface of the heat diffuser (26) improves both heat dissipation and adhesion to the casting resin.
priorityDate	1992-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268

Total number of triples: 71.