abstract |
The present invention provides a copper-nickel alloy electroplasty bath characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of salts that impart conductivity that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfonamides and salts of these compounds and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplasty bath is also characterized by having a pH of 3-8. |