http://rdf.ncbi.nlm.nih.gov/pubchem/patent/LV-15390-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ff8af48e9a475fbd8cd23cbd6f473014
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
filingDate 2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_945182eb43c6a318162cfa0fe79f0f1e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7fef67aa8b4b4746544a261e932c812
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_224fa3082ba9da3c210ae9ad82b94498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_291ebeb6b73921276ba7a871a53823df
publicationDate 2020-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber LV-15390-B
titleOfInvention Construction of hollow minispheres and its manufacturing method
abstract A structure consisting of interconnected hollow metal minispheres of diameter D comprising at least one through hole, one or more of said minispheres being optionally filled with a liquid, characterized in that the diameter d of said opening is in the range of 0, 01 D to 0.30 D. A method of manufacturing a hollow minisphere structure according to claim 1, comprising the following sequential steps: a) preparing a hollow minisphere with a diameter D; (b) stacking of hollow minispheres in space; c) forming at least one through hole in the wall of the minisphere with the action of a laser beam, the diameter d of the opening being in the range from 0.01 D to 0.30 D; (d) connecting hollow minispheres to laser welding by heating the contact area of the minispheres through an opening in the wall of the minisphere. The method of claim 2, further comprising the steps of: a) filling the hollow minisphere with a liquid: water, a polymer blend, or oils; (b) sealing of orifices to prevent leakage of liquid from the spherical cavities by means of a metal powder-based sealing solder paste. The method of claim 2, further comprising sealing the orifice of the minisphere wall with a low melting material, wherein the melting point is lower than the melting point of the minisphere material.
priorityDate 2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962

Total number of triples: 17.