| abstract |
The invention discloses a polymer matrix composite and a laminate, a prepreg and a printed circuit board using the polymer matrix composite. The polymer matrix composite includes a polymer resin and a nonwoven reinforcement material having a dielectric constant of about 1.5 to 4.8 and a dissipation factor of less than 0.003 at 10 GHz. The printed circuit board uses a laminate that has a polymer matrix composite as a core layer. The core layer is sandwiched between at least two outer layers. The polymer matrix composite disclosed in the present invention and the laminate, prepreg and printed circuit board using the polymer matrix composite can effectively reduce the transfer delay and weaving effect by using a special non-woven reinforcing material. |