http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-980003884-A

Outgoing Links

Predicate Object
filingDate 1996-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1998-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-980003884-A
titleOfInvention Resist Pattern Formation Method
abstract The present invention relates to a method for forming a resist pattern of a semiconductor device, comprising a nitride film ( ), A titanium oxide (TiN), a BPSG film or a surface of the lower layer where scum or footing is formed by oxidizing with oxygen plasma to form a thin oxide film, applying a chemically amplified resist, and then applying a resist pattern through an exposure and development process. By forming, it is possible to solve a problem in which footing, scum, and the like remain when forming a resist pattern.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030010324-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030062200-A
priorityDate 1996-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707770
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID93091
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523291
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559362
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID977
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419593465
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID26042
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61685

Total number of triples: 18.