http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-980002293-A

Outgoing Links

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42
filingDate 1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1998-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-980002293-A
titleOfInvention Electroless plating of palladium or palladium alloys on copper and iron-nickel alloys
abstract A method of electroless plating palladium or palladium alloys on semiconductor leadframes, printed circuit boards, and connectors made of copper and iron-nickel alloy materials is disclosed, which is 5-8 g / l palladium metal, or palladium metal. A method of electroless plating a palladium or palladium alloy on a plated body made of copper alloy or iron-nickel alloy using a palladium or palladium alloy plating composition consisting of an aqueous solution containing 5-8 g / l and 1-5 g / l of the alloy metal. to be.n n n According to the present invention, the contact between the leads due to silver discoloration and thick plating, pollution problem by lead, non-uniform plating thickness, bending of the material in the mechanical process, and thus low characteristics problems were solved, and corrosion resistance, solderability, adhesiveness, etc. A better plating layer can be obtained.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100587188-B1
priorityDate 1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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