http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-970077244-A

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
filingDate 1996-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1997-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-970077244-A
titleOfInvention Plasma forming apparatus and etching method of semiconductor device using the same
abstract The present invention relates to a plasma forming method and an etching method of a semiconductor device using the same. In the etching process for manufacturing a semiconductor device, a high frequency current generated from a high frequency generator through a coil antenna formed around an etching chamber, A helicon and a plasma forming device are used to supply the direct current supplied by the supply means. According to the present invention, the configuration of the helicon plasma forming apparatus can be simplified by omitting the electromagnet in the configuration of the helicon plasma generating apparatus.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100440736-B1
priorityDate 1996-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2244
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556224

Total number of triples: 18.