| abstract |
(assignment)n n n Provided are a method and apparatus for manufacturing a semiconductor device which does not damage the semiconductor element.n n n (Solution)n n n A first through hole (2) through which a bonding pad (6) of the semiconductor element (5) and a metal fine wire (3) for connecting an external conductor electrically connected to the bonding pad (6) are provided. (2) a bonding mechanism (1) for bringing the tip portion (4) of the fine metal wire (3) protruding outward into contact with the bonding pad (6), wherein the bonding mechanism (1) comprises a bonding pad (6) and the And a second through hole 12 for supplying an adhesive for adhering the tip 4 of the metal thin wire 3, the second through hole 12 having a metal thin wire 3 and a bonding pad 6. It is formed in the direction in which an adhesive is supplied to the contact point of. |