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filingDate 1997-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1997-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-970065773-A
titleOfInvention Microetching Composition of Copper or Copper Alloy
abstract The present invention relates to (a) nitric acid or sulfuric acid, or both, (b) ferrous nitrate or ferrous sulfate or both, (c) unsaturated carboxylic acids, salts of unsaturated carboxylic acids, and anhydrides of unsaturated carboxylic acids. It relates to a composition for microetching copper or copper alloy, comprising at least one component selected from the group consisting of and (d) water. The composition can produce a copper or copper alloy surface that is excellent in adhesion to resins such as prepregs or resists and has excellent solderability. The composition is suitable for making printed-wiring substrates having highly integrated fine line patterns.
priorityDate 1996-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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