| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip bonding method in which a bump is formed on a semiconductor chip, and a circuit part is mounted upside down on a substrate. The wire ball bonding device is mounted on an aluminum bond pad on a semiconductor chip. Forming Au bumps by performing Au wire ball bonding, and forming Sn / Pb alloy bumps to surround the Au bumps by performing Sn / Pb alloy wire ball bonding with wire ball bonding equipment on the Au bumps And applying an activation solvent (Flux) to the Sn / Pb alloy bumps, and then performing heat treatment in a furnace to reshape the bumps into a ball shape having a desired shape, and applying the activation solvent to the substrate. After that, the semiconductor chips having Sn / Pb alloy bumps formed on the reformed ball bumps or the Au bumps not subjected to the reforming step are aligned thereon and subjected to heat treatment in a furnace. A semiconductor chip bonding characterized in that comprising the step of bonding. |