http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-970018100-A

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
filingDate 1995-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1997-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-970018100-A
titleOfInvention Contact hole filling method
abstract The present invention relates to a method of filling a contact hole, comprising forming an oxide film exposing a diffusion region of a conductive wire or a semiconductor substrate by a contact hole, and sequentially forming a barrier metal layer and a wet layer in an upper portion of the oxide film and inside a contact hole. After forming a conductive metal layer on the wet layer by CVD, cleaning and etching in a plasma state to remove impurities and oxides on the surface of the conductive metal layer, the temperature of about 300 ~ 500 ℃ in the reactor to perform the cleaning etching The conductive metal layer is reflowed to fill the voids to fill the contact holes. Therefore, the mobility of atoms on the surface of the conductive metal layer can be improved to allow reflow at low temperatures, thereby reducing the occurrence of spikes on the PN junction surface, and the improved mobility of atoms on the surface of the conductive metal layer creates an island. This can prevent the wires from being broken.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100640162-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100400248-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100325704-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7694385-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100411144-B1
priorityDate 1995-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 26.