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filingDate 1996-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1997-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-970008448-A
titleOfInvention Ultrasonic bonding method and ultrasonic bonding apparatus
abstract The present invention relates to an ultrasonic bonding method for ultrasonically bonding a connection wire to a metal electrode terminal of a semiconductor device and to an ultrasonic bonding apparatus for ultrasonic bonding a connection wire to a metal electrode terminal provided on a semiconductor substrate, And the vibration frequency thereof is 70 KHz or more. As a result, physical damage such as cracks in the lower portion of the metal electrode terminal can be prevented.
priorityDate 1995-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 53.