http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-960029370-A

Outgoing Links

Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-87
filingDate 1995-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1996-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-960029370-A
titleOfInvention Method for producing polyamideimide resin by direct polymerization
abstract An object of the present invention is to improve the low heat resistance, low melt flowability which is pointed out as a problem in the known production method of PAI resin, and to provide a method for producing a high molecular weight PAI resin having high economical efficiency by simplifying the manufacturing process.n n n The present invention condensation reaction of an aromatic tricarboxylic acid anhydride with a diamine in a polar solvent to prepare a diimide dicarboxylic acid, using an acyl halide agent as a catalyst to form an intermediate having excellent reactivity at a low temperature, and then a nucleophilic diamine The present invention relates to a method for producing a high molecular weight PAI resin by direct polymerization. According to the present invention, a high-molecular weight PAI resin having excellent heat resistance and melt flowability can be produced in a short time of less than 10 hours at a relatively low temperature of 100 ° C. or less, and the PAI resin produced by the present invention has a reduced solubility and tar phase. Since there is no color and physical property deterioration due to the mixing of materials, it is not only used as a thermoplastic molding material, especially a core heat-resistant structural material of the high-tech industry, but also widely applied to heat-resistant paints, heat-resistant sheets, heat-resistant adhesives, heat-resistant fibers and heat-resistant films .
priorityDate 1995-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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