http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-960009238-A

Outgoing Links

Predicate Object
filingDate 1995-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1996-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-960009238-A
titleOfInvention Mold-lubricating material which is processed in a mold for molding an optical-semiconductor device and a method for producing a packaged optical-semiconductor device using the mold-lubricating material.
abstract (A) Epoxy resin, (B) hardening agent, (C) hardening accelerator of this invention, (D) Oxidized polyethylene wax with an average molecular weight number of 1,000-10,000, Oxidized polypropylene wax with an average molecular weight number of 1,000-10,000, and its mixture Mold-lubricating material to be treated in a mold for molding an optical-semiconductor device, comprising a low molecular weight polyolefin wax (5-50% by weight of the sum total of components (A), (B), (C) and (D)) selected from Silver forms a coating with excellent release persistence on the mold surface, eliminating the need for dummy shots and increasing the number of repeat shots that package the optical-semiconductor device, inorganic fillers with organic hardness of 1-7, organic fillers and their It is further improved by adding the selected filler (E) in the mixture.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100944501-B1
priorityDate 1994-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458397310
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23954
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426260547
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557109
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24847855

Total number of triples: 13.