http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-950033479-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S29-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S29-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-12 |
| filingDate | 1994-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1995-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-950033479-A |
| titleOfInvention | Gas and Humidity Sensor |
| abstract | The die bond of the gas sensor substrate is improved, and (1) dispersion of die bond strength, (2) dispersion of wire bond strength, and (3) crack generation to the substrate during die bonding are prevented. On the back surface of the alumina substrate 2, the glass layer 12 and the gold face layer 10 are laminated, and a parallel gap is welded to the gold plating layer 14 of the frame 4. The gold paste layer 10 is welded to the gold plated layer 14 by the heat during parallel gap welding, so that uniform die bond strength is obtained and the die bond material is not scattered to the sensor body 16 side. Bond strength is obtained. Furthermore, the thermal shock during the die bond is prevented from being transferred to the substrate 2 in the glass layer 12 and the crack during the die bond is prevented. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030003171-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030013234-A |
| priorityDate | 1994-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.