http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-950009951-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
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filingDate 1994-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1995-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-950009951-A
titleOfInvention Manufacturing method of semiconductor integrated circuit device
abstract In order to form an insulating film layer having a flat surface on the wirings of the underlying wiring layer subjected to the CVD method and the stutter etching method, which simultaneously form the silicon oxide film on the wiring, the silicon oxide film 20a is larger than the wiring width 1. A semiconductor integrated circuit device for forming a spin on glass (SOG) film on the surface of the silicon oxide 20a having a small size of each of the protrusions, and then etching back at least a part of the SOG film to complete the insulating film layer with a flat surface. Manufacturing method.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100650711-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100971906-B1
priorityDate 1993-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 23.