| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1669
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1619 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
1988-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1995-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb44ab2310b00a41d8c70a6a1a9671f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5759081d1225734fd66b1d974a34410d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bf53515ecfdff449450aa1656ce87eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a3ce3bb20300609cc1b9724fb6424ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65b09ec8ff6317b187d55b64a6d0b9ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71915e6eb7ec739b6df152e4632b1a79 |
| publicationDate |
1995-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-950002051-B1 |
| titleOfInvention |
Electroless Copper Plating Method and Apparatus Used Here |
| abstract |
No content. |
| priorityDate |
1987-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |