| abstract |
SUMMARY OF THE INVENTION The present invention aims to provide a ceramic substrate having a semiconductor LSI, a chip component, and the like, in which a solder bridge is hardly generated and highly reliable, and a method of manufacturing the same. A process of drilling a green sheet 그린 for water composition, a step of filling the hole with a conductor paste, a step of forming a wiring pattern 에 in the green sheet for substrate composition, and a green sheet for constituting the protrusions as an outermost layer, By forming a green sheet for substrate construction as an inner layer, firing the laminate, and removing the outermost layer of the fired product, a projection formed of a conductor is formed during the manufacture of the ceramic wiring board. It became possible to do that. By using a projection made of a conductor as an external connection terminal, it is possible to widen the connection interval between the ceramic substrate having the projection and another arbitrary substrate, and to eliminate a problem such as a solder bridge generated when connecting the substrate. will be. |