| abstract |
The photosensitive resin composition of this invention consists of a polyimide precursor represented by following General formula (1), and o-naphthoquinone diazide sulfonic-acid ester.n n n n n n n n In the formula, X is a tetravalent organic group, Y is a divalent organic group, R 1 to R 3 are a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, and p, q and m are integers of 1 or more.n n n The photosensitive resin composition of this invention has little incorporation of an ionic impurity, The solution provides the resin film which was excellent in storage stability, has a favorable sensitivity, and is easily patterned. |