http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-930020592-A

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
filingDate 1993-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1993-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-930020592-A
titleOfInvention Etching Method of Polyside Film
abstract A reaction gas containing at least one of HBr gas, Br₂ gas and BBr₃ gas activated by plasma discharge, and an etching resistant film made of an inorganic compound while the temperature of the base material is maintained at 60 ° C or higher. The present invention provides a method of dry etching a two-layer film formed of a polycrystalline silicon film and a metal silicide film formed on a base material. In this way, it is possible to improve the controllability and the selectivity of etching without using prone gas, and furthermore, to make the shape after etching of the etching material irrespective of the ratio of the area of the area where the etching resistant film is formed with respect to the exposed area of the etching material. It is possible.
priorityDate 1992-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 35.