http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-930019405-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-06 |
| filingDate | 1992-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-930019405-A |
| titleOfInvention | Manufacturing method of copper perforated printed wiring board |
| abstract | An etching resist layer is formed on the copper plating of the double-sided copper clad laminate to produce a copper perforated printed wiring board. The etch resist layer applies a negative resist pattern on both sides of the laminate, and then laminates the salts of 2-alkylbenzimidazole, 2-alkylalkylbenzoimidazole, 2-phenylbenzimidazole and 2-phenylalkylbenz imidazole. It is formed by immersion in a solution containing one or more. After the obtained etching resist layer is selectively removed with an aqueous alkali solution, the exposed copper plating is etched with an alkali etchant according to a predetermined pattern of wiring. According to the method of the present invention, significant advantages can be obtained in the production of copper perforated printed wiring boards such as improved productivity, low manufacturing cost, reduction of toxic substances in waste water and high certainty. |
| priorityDate | 1992-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 200.