http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-930014855-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1991-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-930014855-A |
| titleOfInvention | Tape automated bonding (TAB) method and its structure |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape automated bonding (TAB) method and a structure thereof, wherein a bump of conductive bump is connected to an inner lead of a tape tape in a tape automated bonding method for electrically connecting and connecting an inner lead of a semiconductor chip and a step tape. Forming a multi-layered metal layer on the bond pads of the chip to which the bumps are connected, and pressing and thermocompression bonding the inner pads of the step tapes provided with the bumps and the bond pads of the chips to a predetermined pressure. The step of forming a bump on the step tape is a step of plating gold or tin on the inner lead and then di-painting the bump forming part by a photo / etch method and chrome around it. A bump is formed by forming a layer to deposit the solder and then reflow soldering. According to the present invention as described above, it is possible to reduce the loss caused by bumping the defective chip and to realize a high reliability package. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100454381-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6798050-B1 |
| priorityDate | 1991-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.