http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-930007319-A
Outgoing Links
| Predicate | Object |
|---|---|
| filingDate | 1991-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-930007319-A |
| titleOfInvention | Electrolytic Copper Foil for Printed Circuits |
| abstract | In the present invention, the copper foil having a basic copper layer is roughened by a conventional method, and then nickel sulfate (hexahydrate) 6-10 g / l, zinc sulfate (hexahydrate) 40-60 g / l, copper sulfate 2-5 g / l In a plating liquid containing 10-20 g / l ammonium sulfate and adjusted to pH 4-5 (controlled with sulfuric acid), the plating liquid was electrodeposited at 20-40 ° C. and a current density of 4-10 A / dm 2 for 3-10 seconds. The present invention relates to an electrolytic copper foil for printed circuits produced by chromatizing for about 5 seconds in a chromate treatment solution of sodium bichromate at a temperature of about 30 V in a chromate treatment solution of 5 g / L. And it becomes possible to manufacture the electrolytic copper foil excellent in heat resistance and chemical resistance. |
| priorityDate | 1991-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.