Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89a0e17b5f0b374583045fce8a8c23d8 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-06 |
filingDate |
1988-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1991-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe9eebfd43cf8599c05e0431bae295b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_565f5066156da4898a093a0ddb8eb3dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21fe224564dde5c4ee0f7781f872a1ed |
publicationDate |
1991-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-910010050-B1 |
titleOfInvention |
Epoxy Resin Compositions for Semiconductor Sealing |
abstract |
No content. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102006030038-A1 |
priorityDate |
1988-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |