| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fda353b84ebf303bfc237d8bd8e22966 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12 |
| filingDate |
2021-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf7f5f7933aad535f76f226c1b5e1a5d |
| publicationDate |
2022-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20220164718-A |
| titleOfInvention |
Method for manufacturing a resin molded material for semiconductor encapsulation, method for manufacturing a semiconductor package, and method for manufacturing a semiconductor device |
| abstract |
A manufacturing method of a resin molded material for semiconductor encapsulation, a manufacturing method of a semiconductor package, and a manufacturing method of a semiconductor device capable of further reducing the content of conductive foreign matter are provided. In a method for producing a resin molded material for semiconductor encapsulation, a mixture containing a thermosetting resin, a filler and a solvent is sprayed and dried. |
| priorityDate |
2020-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |