| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2021-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acae31c95f364755fef427298b3c461d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c37832c4c38c6fa48bdcd202f67dd280
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_252435aeba05055a3f30af15368c9341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5040f708f83a5298a98d1e2404a548e7 |
| publicationDate |
2022-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20220152208-A |
| titleOfInvention |
Sheet for forming protective film |
| abstract |
It was made into a subject to provide the sheet|seat for protective film formation which can suppress the short circuit of the narrow-pitched bumps. And this subject is a sheet for forming a protective film having a laminated structure of a curable resin film (x) and a support sheet (Y), which has a plurality of bumps and satisfies specific requirements indicating that it has narrow-pitched bumps. It was used to form a protective film (X) on the bump formation surface of a semiconductor wafer, and it was solved by setting it as a sheet for forming a protective film that satisfies the specific requirements defined by the tensile modulus E'. |
| priorityDate |
2020-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |