patent/KR-20220149466-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220149466-A

Outgoing Links

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assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_116ba2cc08f509fc678c99a01c7092ca
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1581 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10901 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3447 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-163 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-111
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3468 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-034 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K31-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-1464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-0465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3447 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3415
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
filingDate	2022-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20d20a342c2c4e10786f646b8acd60f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c61e368ebfac6366b55b2726a9806f90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34baa4b551d2e5eea2556302cd7fdc1f
publicationDate	2022-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20220149466-A
titleOfInvention	Method and apparatus for soldering an electronic component to a circuit board, computer program product and computer-readable medium
abstract	The present invention relates to a method for soldering an electronic component (1) having a pin (4) to be inserted into the through hole (3) to a circuit board (2) having a through hole (3). In this method, a liquefied solder ball 5 is applied onto the circuit board 2 so that a portion of the liquefied solder ball 5 flows into and fills the annular gap between the pin 4 and the through hole 3 . thing, especially characterized by being sprayed.
priorityDate	2021-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24404 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559532

Total number of triples: 42.