| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2038-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-02 |
| filingDate |
2021-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e2c01718515e88064b075cb31993771 |
| publicationDate |
2022-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20220142447-A |
| titleOfInvention |
A composite for forming a back protective film, a manufacturing method of a first laminate, a manufacturing method of a third laminate, and a manufacturing method of a semiconductor device with a back protective film |
| abstract |
A composite for forming a back surface protective film in which a protective layer 12 and a film 13 for forming a back protective film are laminated, the film 13 for forming a back protective film is attached to the back surface of a semiconductor substrate, 1st lamination process of obtaining the 2nd laminated body in which the film for formation 13 and the protective layer 12 were laminated|stacked in this order, hardening the film 13 for forming a back surface protective film of the said 2nd laminated body, and a back surface protective film The semiconductor substrate, the back surface protective film, and the protective layer 12 are laminated in this order, including a curing step of A composite (1) for forming a back surface protective film, which is used in the manufacturing method of the first laminate. |
| priorityDate |
2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |