Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3341 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68742 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68757 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
filingDate |
2020-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f11624fd0cc243ed9b353bd83206645f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef77dd8de16e4cd712fd6a822a4065a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_638eff465046849df93493e00bcd0c0f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ccc62bdb7659b13947af80a51fbaf08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1338b99d0d24998c754b68a537395a76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d00365d26d0e02de0bbe9a11c4b2f27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d44d073fd68554e33e7243b991d1a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2c4201cfc2ef9aa52491f31b6cdc994 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c280b1770e12c01885b3b6bf1ecde91c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d6dc81bd45feb9366b9db4505b8686b |
publicationDate |
2022-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20220113761-A |
titleOfInvention |
Electrostatic Chuck with Reduced Current Leakage for Hybrid Laser Scribing and Plasma Etching Wafer Singulation Processes |
abstract |
Electrostatic chucks with reduced current leakage and methods of dicing semiconductor wafers are described. In an example, an etching apparatus includes a chamber and a plasma source in or coupled to the chamber. An electrostatic chuck is in the chamber. The electrostatic chuck includes a conductive pedestal having a plurality of notches in its circumferential edge. The electrostatic chuck also includes a plurality of lift pins corresponding to notches of the plurality of notches. |
priorityDate |
2019-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |