| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3d78aef0c8e22fe8533eb2fa0c459aa6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J7-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0203 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2021-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b02550d67bc1b05c1c32c9d6a9eb6a5f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86615edff71dd5578d72d72f5346df46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3baf1214a535f152cd53702b5b6aaea9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c328e6169dc3f296b9746c8a88158114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b0b2fea631f2040470cf7968fbf3c6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_031b310d19b2625454868707be420af3 |
| publicationDate |
2022-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20220081886-A |
| titleOfInvention |
Electrical Device having Cooling Structure using Filler and Manufacturing Method of the Same |
| abstract |
The present invention relates to an electric device including a substrate module accommodated in a case, and more particularly, heat dissipation using a filler that reduces heat outside the case while increasing the heat dissipation efficiency of the substrate module by using the filler filled in the case It relates to an electric device having a structure and a method for manufacturing the same. |
| priorityDate |
2020-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |