Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01e48e78fadaaec045333f9ad5a6e0b5 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02216 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0752 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0332 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D183-06 |
filingDate |
2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28bb0cf382cafaf91554c3159b73d74b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1f5642b1d3469a67015c1b9fe8465bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e6f79508a77990043d2c41924a44f5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2a78560ed632fa4866e5289fcb5a7a3 |
publicationDate |
2022-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20220051847-A |
titleOfInvention |
Underlayer for EUV Lithography |
abstract |
A novel lithographic composition for use as an EUV silicon hardmask layer is provided. The present invention provides a method for manufacturing a microelectronic structure using an EUV lithography process and the resulting structure formed thereby. Such methods involve the use of a silicon hardmask layer directly under the photoresist layer. The silicon hardmask layer may be applied directly to the substrate, or it may be applied to any intermediate layer(s) that may be applied to the substrate. A preferred silicone hardmask layer is formed from a spin-coatable polymer composition. The present invention improves adhesion and reduces or eliminates pattern collapse problems. |
priorityDate |
2019-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |