| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2351-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13398
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2020-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e16cb063e56402bc686815be57c42fc6 |
| publicationDate |
2022-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20220047252-A |
| titleOfInvention |
Resin particle, electroconductive particle, an electrically-conductive material, and bonded structure |
| abstract |
To provide resin particles capable of increasing the contact area and frictional resistance between resin particles or particles using resin particles and an adherend, and thus suppressing interfacial peeling between resin particles or particles using resin particles and an adherend do. The resin particle according to the present invention is released from compression after holding at 200° C. for 10 minutes in a state in which the resin particle is compressed by 30% with respect to the particle diameter, and one end in the compression direction of the resin particle after compression release. When the distance between and the other end is X, the long diameter of the resin particle after compression release at a position of 0.05X from the one end toward the other end is 0.5X from the one end toward the other end Ratio with respect to the long diameter of the said resin particle after the said compression release in the position is 0.60 or more and 0.95 or less. |
| priorityDate |
2019-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |