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publicationDate 2022-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20220044801-A
titleOfInvention Apparatus and method for CMP temperature control
abstract A chemical mechanical polishing system includes a platen for supporting a polishing pad having a polishing surface, a conduit having an inlet coupled to a gas source, and a platen coupled to the conduit and directing gas from the gas source onto the polishing surface of the polishing pad. It includes a dispenser having a reducing-expanding nozzle suspended above it.
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