| abstract |
According to the present invention, 1 to 1.5 wt% or less of the main material containing at least one of P, In, Bi, and Sb is mixed in a base material, which is an alloy of Sn and Zn, in a total amount of 1 to 1.5 wt% or less to melt/alloy SnZn solder and It relates to a manufacturing method thereof. According to the present invention, it is possible to provide an inexpensive solder that can be very firmly bonded to an electrode such as a solar cell substrate, is strong in high and low temperature repeated tests, and has a melting temperature that is substantially the same as or lower than that of the SnZn alloy as a base material. can |