| abstract |
A curable resin composition comprising at least one resin selected from the group consisting of a polyimide precursor, a polyamideimide precursor, and a polybenzoxazole precursor, and a compound having a structure represented by the following formula (1-1); A cured film formed by curing a curable resin composition, a laminate including the cured film, a method for producing the cured film, and a semiconductor device including the cured film or the laminate; In formula (1-1), Ar represents an aromatic heterocyclic structure, and * represents a bonding site with another structure. |