| abstract |
[Problem] To provide a cured resin composition excellent in room temperature stability for obtaining a cured product such as high heat resistance, a cured product thereof, and a method for producing the cured resin composition and the cured product. Moreover, the semiconductor device using the said hardened|cured material as a sealing material is provided. [Solution means] (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings, and (B) at least one epoxy compound having at least one norbornane structure and at least two epoxy groups. A composition for a cured resin containing an epoxy compound comprising an epoxy compound, (C) a curing agent, and a polystyrene conversion weight average molecular weight of a blend comprising (A), (B) and (C) of 350 or more and 650 or less, a cured product thereof, and the above It is set as the manufacturing method of the composition for cured resins and the said hardened|cured material. Moreover, it is set as the semiconductor device in which the semiconductor element is provided in the hardened|cured material formed by hardening|curing the composition for cured resins containing components (A)-(C), optionally (D), (E). |