| abstract |
The present invention provides a resin film and a metal foil laminate for a wiring board having excellent heat resistance, dimensional stability, flexibility, and adhesion, as well as high transparency, which are represented by thermal expansion coefficient. The present invention is a resin film having a plurality of polyimide layers, the following conditions a and b; a) The thickness should be within the range of 5㎛ or more and 200㎛ or less; b) the total light transmittance is 80% or more; the polyimide contains 50 mol% or more of the acid anhydride residues derived from the aromatic tetracarboxylic acid anhydride represented by the following general formula (1) with respect to the total acid anhydride residues, A resin film comprising 50 mol% or more of a diamine residue derived from an aromatic diamine compound represented by the following general formula (2) with respect to all diamine residues, and at least one surface of the resin film (insulating resin layer) It relates to a metal foil laminate having a laminated metal layer. |