http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220001671-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_504d5ec604e1b58a53af55b9c62c5668 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13 |
| filingDate | 2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8829710c81909dea9cd42ade32c0c297 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f54a4744d334b38a7100eddf0c5d7b6c |
| publicationDate | 2022-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20220001671-A |
| titleOfInvention | Electrically isolated power semiconductor with heat clip |
| abstract | A power semiconductor device having a heat dissipation clip according to the present invention disclosed includes: a DBC substrate having a cavity for mounting a semiconductor chip, and having a lead frame patterned on one surface thereof; a semiconductor chip mounted on a lead frame of the DBC substrate; a sealing resin filled in the cavity; and a heat dissipation clip having one end connected to the semiconductor chip and the other end connected to the surface of the encapsulant resin for heat dissipation. According to the present invention, one end of the heat dissipation clip is connected to the semiconductor chip, and the other end of the heat dissipation clip is connected so that a part of the heat dissipation clip is exposed to the surface of the encapsulant for heat dissipation, so that the heat of the power package can be effectively dissipated by the heat dissipation clip. have. |
| priorityDate | 2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.