| abstract |
The present invention provides a laminate (metal clad laminate) having a low water absorption and excellent properties as a material for a printed circuit board, such as a flexible printed circuit board or a rigid printed board, having a dielectric layer excellent in dielectric properties, heat resistance and adhesion, and a metal foil layer ) is provided. A laminate of at least three-layer structure comprising a metal foil layer, a layer P of non-thermoplastic polyimide, and a layer F of a tetrafluoroethylene-based polymer, wherein at least one of the outermost layers is a metal foil layer, wherein at least one surface of the layer P wherein the layer F is present, the layer P has a water absorption of less than 1.5% and an absolute value of the coefficient of linear expansion of 25 ppm/°C or less. |