| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2003-1059 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2021-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b2a27ccad22e3e6b5507ed2e0715665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf7bf41b630cd67bfaabf3806bfa1a35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17d20a5e26e07d407c204b15c90844ab |
| publicationDate |
2021-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210150294-A |
| titleOfInvention |
Resin molded article for optical semiconductor encapsulation |
| abstract |
[Problem] To provide a resin molding for optical semiconductor encapsulation, which provides an optical semiconductor encapsulant excellent in heat resistance, temperature cycle resistance and solder reflow resistance. [Solutions] A resin molding for optical semiconductor encapsulation that satisfies the following relational expression (1). 0.0005≤E' 265℃ /E' 100℃ ≤0.0050 (1) (Wherein, E′ 265° C. and E′ 100° C. represent the storage modulus (Pa) at 265° C. and 100° C. of the cured body (size: width 5 mm×length 35 mm×thickness 1 mm) obtained by the following method, respectively.) (Manufacturing method of hardening body) A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product. |
| priorityDate |
2020-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |