| abstract |
When used as a conductive particle compounded in an anisotropic conductive adhesive, low conduction resistance and high insulation reliability are compatible, and a conductive particle capable of maintaining a low electrical resistance value even when highly compressed, an anisotropic conductive adhesive using the conductive particle, and A bonded structure and the manufacturing method of electrically-conductive particle are provided. This conductive particle is equipped with a resin particle and the metal layer provided on the surface of the said resin particle, The metal layer is the 1st layer containing copper or nickel and copper, and the nickel-containing agent in the order close|similar to the resin particle. It has two layers, the length in the thickness direction of a metal layer contains the grain containing 4 nm or more of palladium, and the processus|protrusion is formed in the outer surface of the metal layer. |