| abstract |
In one embodiment, the structure comprises a core substrate, a redistribution structure coupled to a first side of the core substrate, wherein the redistribution structure comprises a plurality of redistribution layers, each comprising a dielectric layer and a metallization layer. A wiring layer and a first local interconnection component embedded in a first redistribution layer of the plurality of redistribution layers, the first local interconnection component comprising a substrate, an interconnection structure on the substrate, and conductive connectors, the conductive connectors comprising the first bonded to the metallization layer of the redistribution layer, wherein the metallization layer of the first redistribution layer comprises first conductive lines and first conductive vias, and wherein the dielectric layer of the first redistribution layer encapsulates the first local interconnect component. a first local interconnection component comprising: a first integrated circuit die coupled to the redistribution structure, the redistribution structure interposed between the core substrate and the first integrated circuit die; 2 integrated circuit die, wherein the redistribution structure is interposed between the core substrate and the first integrated circuit die, and the interconnect structure of the first local interconnection component electrically couples the first integrated circuit die to the second integrated circuit die; , and a set of conductive connectors coupled to the second side of the core substrate. |