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publicationDate 2021-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20210122055-A
titleOfInvention Resin molded article for optical semiconductor encapsulation and manufacturing method thereof
abstract The production margin in optical semiconductor production is wide, and the resin molding for optical semiconductor sealing which can be transfer-molded stably, and its manufacturing method are provided. The resin molding for optical semiconductor sealing containing resin whose molecular weight distribution Mw/Mn which is ratio of weight average molecular weight Mw and number average molecular weight Mn is 2.7 or less.
priorityDate 2020-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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