| abstract |
A photosensitive curable resin composition capable of forming a cured product having excellent resolution and excellent chemical resistance, a dry film having a resin layer obtained from the composition, a cured product of the composition or a resin layer of the dry film, and the cured product An electronic component with cargo is provided. A curable resin composition containing (A) a carboxyl group-containing resin, (B) a photoinitiator, (C) an epoxy resin, and (D) silica, wherein as the (D) silica, a silica having a particle diameter of more than 300 nm It does not contain, but ratio of the epoxy group of said (C) epoxy resin / said (A) carboxyl group of carboxyl group-containing resin is 1.9-2.9, The curable resin composition etc. characterized by the above-mentioned. |