| abstract |
[Problem] At the time of transfer molding, since the molded cured product has low modulus and is flexible even at high temperature and has excellent stress relaxation characteristics, it is difficult to cause warpage or defects in the molded product particularly during integral molding with the substrate, and also Provided are a curable silicone composition excellent in mold release (mold release) of the cured product after molding, and uses thereof. [Solution] Measured by MDR (Moving Die Rheometer) at a molding temperature from room temperature to 200 °C (1) the maximum torque value is less than 50 dN m, (2) when the maximum torque value is reached, store A curable silicone composition for transfer molding, wherein a value of a loss tangent (tanδ) expressed as a ratio of torque value/loss torque value is less than 0.2, and use thereof. |