| abstract |
an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a layer of mold material adjacent to the electronic substrate and substantially surrounding the at least one integrated circuit, and at least one structure in the layer of mold material—at least one The structure may be formed of an integrated circuit assembly comprising a material having a thermal conductivity greater than about 10 watts per meter-Kelvin and a modulus greater than about 20 gigaPascals. |